WYLIE BGA Reballing Stencil for iPhone 5/5S/6/6S/7/8 Plus/X/XR/XS 11 12 Pro Max Baseband CPU RAM Nand WiFi Power IC Chip Tin Net

PRODUCT INTRODUCTION

WYLIE mobile phone tin planting steel netting tin planting netting square hole tin planting steel netting square hole tin planting net

PRODUCT FEATURES

Material imported from Japan, square hole process

Integrated network thickness 0.12㎜ 4 in 1 hard disk network thickness 0.2㎜

New upgrade and revision Every integrated network has CPU upper and lower layers

Full of toughness, high temperature resistance and deformation

Suitable for 5/5c/5s/6/6p/6s/6sp/7/7p/8/8p/X/xs/xs max/xr/11/Pro/max/12/12mini/12Pro/max motherboard LCD screen

WYLIE square hole tin planting steel mesh patent number: 201720095938.5