PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
Model Number: HW-Tin Planting Tool
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture
Type1: ForP20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 HW-1
Type2: For HW-2 P10/10P MATE9/PRO NOVE2S HW-2
Type3: For MT8/P9 HI CPU HW-3Type4: For HI/EMMC/EMCP/Qualcomm/WTR HW-4
Features 1: Stepped groove Design
Features 2: High Success Rate of Planting Tin
Features 3: Thicker Than Ordinary Stencils in the Market
Features 4: Accuratea Lignment

PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* This 3D stencil is easy to use no matter you are new or an expert.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

* This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.

Pubblica le informazioni sulle tue esigenze

MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool

Marca: MIJING

Disponibilità:50 i pezzi rimasti (scorte limitate) verranno spediti entro 24 ore

Codice prodotto: 20018157

Tempi di consegna: Trova il tempo di ricezione stimato nel carrello

$21.42 21.42

Opzioni disponibili

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