M-Triangel Intelligent Laser Separating Machine For i Phone XR XS Max X 8 Back Glass LCD Frame Removing Repair,
Mobile Phone Back Glass Separate Laser Machine,
DIY Logo machine Laser Marking Machine.

Laser Marking Machine Separating machine for phone back glass Removing Repair

Laser Marking / Laser Separating / Laser DIY Logo

1. Separate Midframe / Bezel / Back glass, Marking / Engraving

2. Technology Upgrading----Intelligent Ranging System

3. Easy operation, Come with Software and drawings(Continuous updating...)

4. Suitable for all touch screen smart phones Laser Repair in the market: for IPhone, Huawei, XiaoMi,OPPO,vivo,LG series;

5.Many type of metals are workable: Gold, Silver, Stainless Steel, Copper, Aluminum, chrome Brass, etc.

6.Alloy and metal oxides: Anodized Aluminum

7. 12 months warranty, online technical support and training is provied.

Intelligent SP001 Parameters

Laser Power: 20W

Machine Speed: ≤10000mm/s

Marking power: ≤0.001MM

Cooling method: built-in air cooling

Laser wavelength: 1.06μm

Laser equipment size: 300*560*570MM

Power supply:220V ± 10%, 50HZ ± 5%

Ambient temperature: -10 ° C ~ 65 ° C

Repeatability: ≤0.001mm

Marking depth: 0.015-0.5mm

Marking range: 175*175mm

Marking line width: 0.05-0.01mm

Equipment weight: 32kg

Packing Size: 630x600x300mm

Gross weight: 28kg

Automatic SP002 Parameters

Laser Power : 20W

Machine Speed:≤10000mm/s

Marking power:≤0.001MM

Cooling method:built-in air cooling

Laser wavelength:1.06μm

Laser equipment size:300*496*548.5MM

Power supply:220V ± 10%, 50HZ ± 5%

Ambient temperature:-10 ° C ~ 65 ° C

Repeatability:≤0.001mm

Marking depth:0.015-0.5mm

Marking range:175*175mm

Marking line width:0.05-0.01mm

Equipment weight:18.9kg

Packing Size:630x600x300mm

Gross weight :28.92kg

Computer SP003 Parameters

Laser Power : 20W

Machine Speed:≤10000mm/s

Marking power:≤0.001MM

Cooling method:built-in air cooling

Laser wavelength:1.06μm

Laser equipment size:300*538*588.5MM

Power supply:220V ± 10%, 50HZ ± 5%

Ambient temperature:-10 ° C ~ 65 ° C

Repeatability:≤0.001mm

Marking depth:0.015-0.5mm

Marking range:175*175mm

Marking line width:0.05-0.01mm

Equipment weight:21.2kg

Gross weight: 32kg

M-Triangel Laser Marking Cutting Separating Machine for iPhone 8 X XS XSMAX Back Glass Remover LCD Frame Removing Repair

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