MJ BGA Reballing Solder Stencil Plant Tin Net for OPPOA3/A1/A73/A79/A83/R11/R15, VIVOX20/X20i/Y75 MT6771/6763/SDM660CPU general series

PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture



PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.