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Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max, Mijing iPH-13
Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max, Mijing iPH-13
Normalpris
$4.49 USD
Normalpris
Udsalgspris
$4.49 USD
Stykpris
/
pr.
Levering beregnes ved betaling.
Tilgængelighed for afhentning kunne ikke indlæses
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design
Specification:
Package Weight |
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