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Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max, Mijing iPH-13

Mijing iPH-13 0.12mm BGA Reballing Stencil Planting for iPhone 11 / 11 Pro / 11 Pro Max, Mijing iPH-13

Normaler Preis $4.49 USD
Normaler Preis Verkaufspreis $4.49 USD
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Option
1. Not easy to deform, prevent heating and bulging accurate hole position, one-time molding
2. Good toughness
3. High temperature resistance
4. 0.12mm, make phone repairs easier, make reballing work easier.
5. Heated anti-drum design


Specification:
Package Weight
One Package Weight 0.04kgs / 0.09lb
One Package Size 19cm * 10cm * 1cm / 7.48inch * 3.94inch * 0.39inch
Qty per Carton 180
Carton Weight 8.20kgs / 18.08lb
Carton Size 40cm * 32cm * 32cm / 15.75inch * 12.6inch * 12.6inch
Loading Container 20GP: 651 cartons * 180 pcs = 117180 pcs
40HQ: 1511 cartons * 180 pcs = 271980 pcs

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