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ORIWHIZ
Mijing IPH-22 0.12mm CPU Comprehensive BGA Reballing Stencil for iPhone 16 Series, Mijing IPH-22
Mijing IPH-22 0.12mm CPU Comprehensive BGA Reballing Stencil for iPhone 16 Series, Mijing IPH-22
Normaler Preis
$2.75 USD
Normaler Preis
Verkaufspreis
$2.75 USD
Grundpreis
/
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Verfügbarkeit für Abholungen konnte nicht geladen werden
1. High-Precision BGA Reballing Stencil: The Mijing IPH-21 is specifically designed for iPhone 16 series, ensuring precise alignment and perfect soldering for each solder point.
2. Enhanced Durability: The surface is specially treated to enhance wear resistance, prolonging the stencils lifespan.
3. Made from high heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use.
4. Easy Operation Design: The stencil design is user-friendly, suitable for all types of technicians, allowing operation without professional training.
5. Enhanced Soldering Quality: With precise hole design, it effectively improves soldering quality, preventing shorts and cold joints.
6. High-Temperature Resistance: Capable of withstanding high temperatures during the soldering process without deforming.
2. Enhanced Durability: The surface is specially treated to enhance wear resistance, prolonging the stencils lifespan.
3. Made from high heat-resistant and non-deformable materials, ensuring long-term stability and reliability during use.
4. Easy Operation Design: The stencil design is user-friendly, suitable for all types of technicians, allowing operation without professional training.
5. Enhanced Soldering Quality: With precise hole design, it effectively improves soldering quality, preventing shorts and cold joints.
6. High-Temperature Resistance: Capable of withstanding high temperatures during the soldering process without deforming.
Specification:
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