MJ BGA Reballing Solder Stencil Plant Tin Net For Samsung C7010/J610 general C7/J3/J5/A5 series and other MSM8916/MSM8953 B01-AB CPU general series

PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture



PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.