MJ BGA Reballing Solder Stencil Plant Tin Net Qualcom CPU

PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture



PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.