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2UUL

2uul PH11 Motherboard PCB Delamination Rebonding HOT-BLOCK Preheater, EU Plug, US Plug

2uul PH11 Motherboard PCB Delamination Rebonding HOT-BLOCK Preheater, EU Plug, US Plug

Regular price $46.17 USD
Regular price Sale price $46.17 USD
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1. Equipped with precise temperature control ranging from 40 to 245 degrees Celsius, ensuring even heat distribution and preventing localized overheating of PCB boards.
2. Specially developed for smartphone motherboard delamination, screen separation, and BGA rework applications, improving repair success rates.
3. Powered by a 240W heating module, allowing fast temperature rise and significantly reducing repair waiting time.
4. Digital temperature regulation ensures consistent thermal output, ideal for microelectronics and chip-level repair tasks.
5. Small footprint (10.5 x 12.2 x 3.2cm) makes it ideal for professional repair benches without occupying excessive workspace.
6. Widely used in smartphone repair, PCB reballing, chip removal, and layered motherboard separation processes.


Specification:
Package Weight
One Package Weight 0.65kgs / 1.44lb
One Package Size 26cm * 18cm * 6cm / 10.24inch * 7.09inch * 2.36inch
Qty per Carton 20
Carton Weight 13.20kgs / 29.10lb
Carton Size 54cm * 38cm * 32cm / 21.26inch * 14.96inch * 12.6inch
Loading Container 20GP: 406 cartons * 20 pcs = 8120 pcs
40HQ: 942 cartons * 20 pcs = 18840 pcs

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