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ORIWHIZ
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11, BaKu For IPhone A11
BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11, BaKu For IPhone A11
Prezzo di listino
$47.73 USD
Prezzo di listino
Prezzo scontato
$47.73 USD
Prezzo unitario
/
per
Spese di spedizione calcolate al check-out.
Impossibile caricare la disponibilità di ritiro
1. Fast and stable, precise positioning
2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.
3. Assist professionals to carry out BGA tin planting in a convenient and safe way.
4. For iPhone A11
5. The strength is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams
Specification:
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