Passa alle informazioni sul prodotto
1 su 6

ORIWHIZ

BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11, BaKu For IPhone A11

BaKu 3D BGA CPU Tin Planting Mesh Motherboard Repair Tin Planting Table For IPhone A11, BaKu For IPhone A11

Prezzo di listino $47.73 USD
Prezzo di listino Prezzo scontato $47.73 USD
In offerta Esaurito
Spese di spedizione calcolate al check-out.
Option

1. Fast and stable, precise positioning
2. High temperature resistant material, not easy to deform, no bulge, no virtual welding.
3. Assist professionals to carry out BGA tin planting in a convenient and safe way.
4. For iPhone A11
5. The strength is more durable and not deformed
6. Dimensions: 85 x 85 x 15mm
7. Weight: 376 grams

Specification:
General
Compatible with
Apple: iPhone 11
Package Weight
One Package Weight 0.40kgs / 0.89lb
One Package Size 5cm * 3cm * 4cm / 1.97inch * 1.18inch * 1.57inch
Qty per Carton 74
Carton Weight 30.00kgs / 66.14lb
Carton Size 20cm * 12cm * 16cm / 7.87inch * 4.72inch * 6.3inch
Loading Container 20GP: 6944 cartons * 74 pcs = 513856 pcs
40HQ: 16121 cartons * 74 pcs = 1192954 pcs

Visualizza dettagli completi

Modulo di contatto