1. Solder Paste Scraping Knife for cell Phone BGA Repair and UV Glue Cleaning Tool.
2. Professional and practical, compact and portable.
3. Easy and convenient to carry and use.
4. Professional repair tools aim to giving assistance during devices repairing.
5. Model: 007
6. Adopted cryogenic treatment technology, the blade with high carbon content becomes solid, resilient and precise, which is a good choice for you to remove black glue.
7. Designed in grip-reinforced screw texture, the item can provide friction for you during the glue-removing process, which helps to anti-slip.
8. The delicate blade can be assembled in both ends of the cold knife optionally. What's more, it is simple for you to assemble the knife.


Specification:
Package Weight
One Package Weight 0.06kgs / 0.13lb
One Package Size 19cm * 10cm * 1.5cm / 7.48inch * 3.94inch * 0.59inch
Qty per Carton 120
Carton Weight 7.56kgs / 16.67lb
Carton Size 40cm * 32cm * 32cm / 15.75inch * 12.6inch * 12.6inch
Loading Container 20GP: 651 cartons * 120 pcs = 78120 pcs
40HQ: 1511 cartons * 120 pcs = 181320 pcs

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QIANLI 007 Multifunctioal CPU IC Glue Remover Knife Thin Blade Motherboard BGA Chip Glue Cleaning Knife, QIANLI 007

Marca: ORIWHIZ

Disponibilità:i pezzi rimasti (scorte limitate) verranno spediti entro 24 ore

Codice prodotto: SP7776

Tempi di consegna: Trova il tempo di ricezione stimato nel carrello

$14.40 14.40
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