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MJ BGA Reballing Solder Stencil For Oppo R11 series general VIVO X20/MI/NOTE3 and other models SDM660 CPU general series
MJ BGA Reballing Solder Stencil For Oppo R11 series general VIVO X20/MI/NOTE3 and other models SDM660 CPU general series
Normale prijs
$21.42 USD
Normale prijs
Aanbiedingsprijs
$21.42 USD
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per
Verzendkosten worden berekend bij de checkout.
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PRODUCT INTRODUCTION
Type: Hand Tool Parts
Origin: CN(Origin)
Model Number: for Oppo R11 series general VIVO X20/MI/NOTE3 and other models SDM660 CPU general series
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture
PRODUCT FEATURES
* Stepped groove design enables stencil to align with the tinning position of ic rapidly.
* The square holes design makes it easier to take out the formed solder balls.
* The high success rate of planting tin, the solder balls can be formed once after you are proficient.
Type: Hand Tool Parts
Origin: CN(Origin)
Model Number: for Oppo R11 series general VIVO X20/MI/NOTE3 and other models SDM660 CPU general series
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture
PRODUCT FEATURES
* Stepped groove design enables stencil to align with the tinning position of ic rapidly.
* The square holes design makes it easier to take out the formed solder balls.
* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

