• MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool - ORIWHIZ
  • MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool - ORIWHIZ
  • MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool - ORIWHIZ
  • MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool - ORIWHIZ
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MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool

MJ BGA Reballing Solder Stencil Plant Tin Net for HW-1-4 P20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 Tin Planting Tool

$21.42 USD
$21.42 USD
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PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
Model Number: HW-Tin Planting Tool
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture
Type1: ForP20/20Pro/Mate10/10 Pro/RS/10/V10/Kirin970/Hi3670 HW-1
Type2: For HW-2 P10/10P MATE9/PRO NOVE2S HW-2
Type3: For MT8/P9 HI CPU HW-3Type4: For HI/EMMC/EMCP/Qualcomm/WTR HW-4
Features 1: Stepped groove Design
Features 2: High Success Rate of Planting Tin
Features 3: Thicker Than Ordinary Stencils in the Market
Features 4: Accuratea Lignment

PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* This 3D stencil is easy to use no matter you are new or an expert.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

* This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.

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