QIANLI iBlack 3D Steel mesh Reballing Stencil for Android Qualcomm EMMC MSM EMMC General DDR KIRIN 655 659 MSM 8937 2AA MTK 6582

Product introduction:
QianLi Toolplus Black stencil makes positioning your chip much easier and 100% accurate. Enabling you to work faster and perform a perfectly precise job every time you reball a chip using this stencil.
Details:
DESIGN - Designed to help with repairs
DURABLE - Easy to work with
SIZE - Standard size
3D - Better positioning

Product Features:
1.Square hole technology
2.Toughness, high temperature resistance and deformation
3.New upgrade and revision
4.Integrated steel mesh each network with CPU upper and lower layers
5.Stepped groove design enables stencil to align with tinning position of ic rapidly.
The square holes design makes it easier to take out the formed solder balls. High success rate of planting tin,the solder balls can be formed once afer you are proficient.