• QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
  • QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
  • QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
  • QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
  • QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
  • QIANLI iBlack 3D BGA Stencil A7 A8 A9 A10 A11 CPU RAM For iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reball IC Steel Mesh Tin Net - ORIWHIZ
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QIANLI

QIANLI iBlack 3D BGA Schablone A7 A8 A9 A10 A11 CPU RAM für iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reballing IC Stahlgeflecht Zinn-Netz

QIANLI iBlack 3D BGA Schablone A7 A8 A9 A10 A11 CPU RAM für iPhone 5S 6G 6Plus 6S 6SP 7 7P 8 8P Layer Reballing IC Stahlgeflecht Zinn-Netz

$11.81 USD
$11.81 USD
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PRODUKTEINFÜHRUNG

 

Herkunftsort:
Guangdong, China (Festland)
Markenname:
QianLi
Modellnummer:
3D Android Black Schablone MSM-8937-2AA
Material:
Aluminium

 

PRODUKTMERKMALE

Beschreibung: Quanli 3D Android Black Schablone MSM-8937-2AA Qualcomm Snapdragon

 Funktion: Reballing IC Pins

 

 

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