10PCS Mijing Interposer Middle Board X Middle Frame Board X Middle Frame X Upper And Lower Connecting Board XS XSMAX

Product Features

• MJ interposer Middle Frame BGA Reballing middle-level layer board.

• Apply to XS XS-MAX mode phone during maintenance.

• Can be used MJ interposer Middle Frame for replacement.

• Separate maintenance, for the operation is wrong to middle frame made the damage.

• Note:Need to be dismantled upper and lower motherboards separate maintenance.

Product Specification

• Application:for iPhone XS MAX middle-level layer separate board

• Weight: 0.01kg

• Color: Metal

• Function: BGA reballing double-stacked logic board upper lower layers board frame.