AΜAOΕ X-16 Sereis 28-In-1 Planting Tin Platform Set With Magnet Base Position Plate Middle Layer Solder Tin Net

1. This 28-in-1 Solder Ball Grid Array (BGA) Reballing Station Kit is a comprehensive professional toolkit designed for precise soldering and repair work on various iPhone logic boards. The kit is notable for including multiple specialized stencils and a magnetic base to facilitate accurate component alignment and soldering.
2. Includes 5 Positioning Plates: The kit comes with five dedicated positioning plates (for models IPX-11, IP12, IP13, IP16, and IP14-15) to ensure precise alignment of the motherboard during the reballing process.
3. Sturdy Magnetic Reballing Platform: A strong magnetic base is included to securely hold the positioning plates and logic boards in place, preventing movement and improving soldering accuracy.
4. Wide Array of Specialized Stencils: The kit provides a generous selection of stencils, including two for IP16, four for IPX-11, three for IP15, two for IP14, four for IP13, and three for IP12, catering to various iPhone models.
5. Additional Essential Tools: Beyond the stencils and plates, the set also includes practical accessories like a tin insulation pad and a scraping blade to assist in the repair workflow.