1. Widely used, compatible with chips below 20 x 18.5mm, suitable for most chips
2. When heating, the temperature is adjustable from 160 to 250 degrees Celsius, effectively avoiding chip burns due to excessive temperature or improper adjustment
3. No need for soldering wire, one wipe can easily remove tin and glue, and tinning is easy, convenient and fast
4. No need for soldering iron heating, no need for repeated scraping of soldering iron, no damage to the pad
5. Low voltage heating plate, fast heating, no leakage, no static electricity, safer
6. Hidden screw, flexible and lightweight, flexible telescopic clamping, prevent residue from falling into the screw, more durable and easier to use
7. Size: about 6 x 7 x 1.7cm
8. Weight: about 65g
Specification:
|
Package Weight
|
| One Package Weight |
0.08kgs / 0.19lb
|
| One Package Size |
10cm * 10cm * 4cm / 3.94inch * 3.94inch * 1.57inch
|
| Carton Weight |
33.00kgs / 72.75lb
|
| Carton Size |
50cm * 36cm * 34cm / 19.69inch * 14.17inch * 13.39inch
|
| Loading Container |
20GP: 435 cartons * 400 pcs = 174000 pcs
40HQ: 1011 cartons * 400 pcs = 404400 pcs
|
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