PRODUCT INTRODUCTION

Type: Hand Tool Parts
Origin: CN(Origin)
is_customized: No
Material: Aluminium-copper Alloy
Usage: Commercial Manufacture



PRODUCT FEATURES

* Stepped groove design enables stencil to align with the tinning position of ic rapidly.

* The square holes design makes it easier to take out the formed solder balls.

* The high success rate of planting tin, the solder balls can be formed once after you are proficient.

Post Your Needs Information

MJ BGA Reballing Solder Stencil Plant Tin Net Qualcom CPU

Brand: MIJING

Availability:50 pieces remain(Low stock) will be shipped within 24 hours

Product Code: 20018185

Leadtime: Find estimated receipt time in the shopping cart

$21.42 21.42

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